With the continuous improvement of film final properties and the development of co-extrusion technology, multi-layer structure films have become a common design.
Diamond has high thermal conductivity, excellent insulation performance and low dielectric constant, which are the basic requirements of electronic packaging materials.
(1) Chemical modificationWhen a diamond is treated with an oxidizing acid solution (such as nitric acid, chromic acid, Fenton reagent, etc.), impurities (graphite and metal) on the surface of the diam...
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