Henan E-Grind Abrasives Co., Ltd.

Influencing Factors Of Resin Bonded Material Diamond Tools

The resin bonded material diamond tool is made of resin-bonded material, filler, and diamond abrasive by hot pressing after mixing. Its performance is also directly affected by resin bonded material, filler and diamond abrasive.

(1)The common characteristic of all kinds of resin bonded material diamond tools is poor heat resistance. In the process of processing the workpiece, the heat generated between the diamond tools and the workpiece easily causes the local temperature to be too high. Once the critical value is reached, the control of diamond by resin bonded material is invalid, and the diamond is not completely blunt. It will fall off under the piece, which will greatly increase the processing cost. At present, resin bonded material is mainly modified to improve its heat resistance. Gao Liangxin [3] modified phenolic resin with square alkyl ether, its heat resistance can reach 180 ~C. Du Yang et al. [4] A new borosilicon-containing phenolic resin BSP was synthesized from silicone prepolymer, boric acid, phenol, and formaldehyde. Because of the introduction of B-O bond and organic silicon chain in the structure of phenolic resin, BSP resin has excellent heat resistance and toughness, and also improves the water resistance and storage stability of the resin.

(2)The effect of resin bonded material content. The content of resin bonded material has a great influence on the processing performance of diamond tools. Literature [24] introduced that the hardness and compressive strength of the grinding wheel increased with the increase of resin bonded material content in the single crystal silicon wafer thinning wheel. When the resin bonded material content increased to a certain extent, the increase of the wear ratio of the grinding wheel tended to be slow, while the surface of the grinding wheel was prone to clogging, and the higher the content of resin bonded material. The more serious the blockage is.

(3)The effect of resin bonded material granularity. The particle size of resin powder used for diamond abrasive tools in China is mostly between 80 mesh and 180 mesh. There are two defects in this particle size range. One is that it affects the compaction formability of abrasive tools, and the other is that it may affect the properties of bonds. In the process of pressing, although resin powder can be softened by heat and has a certain fluidity to achieve the purpose of coating abrasive particles, in the process of pressing, the binder is pressed in the die, space is limited, and the flow range of resin is limited. When the particle size of resin powder is coarse, some abrasive bonds are not firm, so it can be removed too quickly. Drop. Some studies have shown that when the particle size of resin is refined, the fluidity of the forming material can be improved, which is beneficial to the hot pressing of abrasive tools.

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