Henan E-Grind Abrasives Co., Ltd.

Study on the Holding Capacity of Light Curing Resin Binder to Diamond Dust Abrasive

>Diamond has many excellent properties, such as high hardness, wear resistance, good thermal conductivity, low friction coefficient and high chemical sentiment. It is often made into grinding tools and widely used in the processing of non-metallic materials. Resin bonded diamond grinding wheel is widely used in precision machining of various materials which are difficult to process due to its good self-sharpening, flexible matrix and easy modification.

The failure behavior of diamond grinding wheel in use will not only increase the replacement quantity of equipment parts, but also directly destroy the surface quality of machined parts, shorten the service life of tools and affect the processing efficiency. The main failure mode of resin bonded diamond grinding wheel is the shedding failure of diamond dust abrasives. In the previous study, our company attributed the failure to the resin deterioration under the action of grinding temperature, which resulted in the falling of diamond dust abrasive. In fact, resin itself and diamond dust abrasives belong to macromolecule materials and crystal materials, so chemical reaction between them is impossible in the process of preparation. For resin bonds, the main way to control diamond dust abrasives is to wrap diamond abrasives.

By simulating the grinding process of diamond grinding wheel, the polished copper block which is scratched with a single diamond dust abrasive is used to measure the grip force of different resin binders on a single diamond. The grip force distribution and failure mode of diamond at different exposure heights are found to analyze the effect of additives and abrasive exposure height on holding capacity in resin.