Diamond High Thermal Conductivity Powder Filler: Leading High-Performance Thermal Management Technol

With the progress of technology and the rapid development of industry, the densification of internal components of electronic devices has led to increasingly serious heat accumulation problems, posing unprecedented challenges for thermal management technology. In this context, traditional thermal management methods can no longer meet the demands of emerging technology fields, especially in AI chips, spacecraft, and high-power lasers, where the demand for efficient thermal interface materials (TIM) is urgent. 

Diamond micro-powder, with its unmatched physical properties, is gradually becoming the core solution to this problem as a top thermal conductive filler. This paper will introduce the significant advantages of diamond micro-powder as a thermal conductive filler.

Extremely High Thermal Conductivity

Diamond micro-powder is renowned in nature for its excellent thermal conductivity, far exceeding that of many metals and alloys. Using diamond micro-powder as thermal conductive filler can significantly enhance the thermal efficiency of composite materials, rapidly conduct heat, prevent local overheating, and ensure the stable operation of the system.

Excellent Hardness and Wear Resistance

As the hardest substance in nature, diamond micro-powder exhibits outstanding hardness and wear resistance. This allows diamond micro-powder as a thermal conductive filler not only to effectively resist wear but also to enhance the mechanical properties of composite materials, extending their service life.

Stable Chemical Properties

Diamond micro-powder has excellent chemical stability against most acids, alkalis, and organic solvents at room temperature. This enables diamond micro-powder to maintain stable thermal conductivity in complex chemical environments, ensuring the long-term stable operation of the equipment.

Excellent Dispersibility

Specially treated diamond micro-powder is easy to uniformly disperse in polymer, ceramic, and other matrices. This uniform dispersibility helps to enhance the thermal uniformity of composite materials, prevents heat concentration, and reduces hotspot issues.

Flexible Customizability

The particle size, shape, and surface characteristics of diamond micro-powder can be adjusted according to actual needs. This customizability allows diamond micro-powder to meet specific requirements in different scenarios, providing more flexible thermal management solutions to users.

Combining these characteristics, diamond micro-powder as a thermal conductive filler has immense application prospects in the field of thermal management. The diamond micro-powder composite powders developed by Eastchem New Materials offer advantages such as low cost and good dispersibility, promising to become indispensable thermal management materials in future high-performance devices and systems, providing strong momentum for the development of technology and industry.