CVD Diamond: a New Super Heat Dissipation Material for "Keeping down the Fever"

At some point, more and more electronic products began to label themselves as "fevers." At first, "fever" was meant to highlight the high performance of the product, but later, it became a derogatory term for consumers to ridicule the product for being too hot. The higher the performance of electronic products, the more difficult it is to manage heat, because as the power density of semiconductor components increases, the heat flux increases.

If such a large amount of heat cannot be exported from the components in time and spread, it will seriously threaten the stability of electronic products. With the increasing requirement of thinness and high efficiency of terminal products, heat and heat dissipation performance have become very important factors in semiconductor design.

CVD diamond is a new advanced thermal management solution that is especially suitable for RF power amplifiers.

As a direct relative of diamond, diamonds with "carbon elemental" properties are not small, including the highest known thermal conductivity, stiffness and hardness, as well as high optical transmission characteristics, low coefficient of expansion and low-density properties in a large wavelength range. Selecting the most appropriate deposition technique is the first step to synthesize CVD diamonds for thermal management applications. Microwave assisted CVD can better control grain size and grain interface to produce high quality and reproducibility polycrystalline diamonds required for specific application thermal conductivity levels.

With the help of recent technological developments, CVD diamond has achieved mass production and rapid cost reduction. The bulk production cost of CVD diamond radiators without metallization is 0.5-1 USD/ m3 and the price depends on the thermal conductivity grade. For applications where the common thickness and transverse dimensions between -0.25 and 0.40mm are equal to the chip size, the RF device diamond radiator size is usually less than 5 m3. Thus, a few extra dollars in incremental costs at the chip level can significantly reduce system costs.