Resin Bond Mesh Diamond

Friable Diamond

Each Particle is with sub-crystal structure. Irregular and Very rough surface. New cutting edges come out during working.

Also available in electroless plating of both nickel (30% and 56% by wt.) and copper (50% by wt.) allowing for better crystal retention in both phenolic and polyimide bond systems.

Application:

For Resin Bond system
Application: grinding tungsten carbide, ceramics, glass, and other non-metal materials.

Resin Bond Mesh Diamond: EA-R15

Rough and very irregular, Highest Friable, Yellow Green Color
Best self-sharpening performance and high thermal stability, suitable for creep grinding, the good choice for high precision grinding where premium surface finish and form remaining are demanded.
Available sizes:60/80 through 400/500

Resin Bond Mesh Diamond: EA-R02

Irregular, medium Friable, balck Color
Economical, desgined for general purpose
Available sizes:60/80 through 400/500

Resin Bond Mesh Diamond: EA-R21

Irregular, low Friable, light Green Color
Similar to EA-R23
Available sizes:60/80 through 400/500

Resin Bond Mesh Diamond: ED-B100

Semi-blocky, very low friability, Black
Premium performance in thermal stability
For Vit bond system with good profile retention and sharpness

Available sizes:

ANSI	60/80	80/100	100/120	120/140	140/170	170/200	200/230	230/270	270/325	325/400	400/500
FEPA	D252	D181	D151	D126	D107	D91	D76	D64	D54	D46	D32
EA-R23	*	*	*	*	*	*	*	*	*	*	*
EA-R11	*	*	*	*	*	*	*	*	*	*	*
EA-R15	*	*	*	*	*	*	*	*	*	*	*
EA-R02	*	*	*	*	*	*	*	*	*	*	*